TY - GEN
T1 - Smart cooling of data centers
AU - Patel, Chandrakant D.
AU - Bash, Cullen E.
AU - Sharma, Ratnesh
AU - Beitelmal, Monem
AU - Friedrich, Rich
PY - 2003
Y1 - 2003
N2 - The data center of tomorrow is characterized as one containing a dense aggregation of commodity computing, networking and storage hardware mounted in industry standard racks. In fact, the data center is a computer. The walls of the data center are akin to the walls of the chassis in today's computer system. The new slim rack mounted systems and blade servers enable reduction in the footprint of today's data center by 66%. While maximizing computing per unit area, this compaction leads to extremely high power density and high cost associated with removal of the dissipated heat. Today's approach of cooling the entire data center to a constant temperature sampled at a single location, irrespective of the distributed utilization, is too energy inefficient. We propose a smart cooling system that provides localized cooling when and where needed and works in conjunction with a compute workload allocator to distribute compute workloads in the most energy efficient state. This paper shows a vision and construction of this intelligent data center that uses a combination of modeling, metrology and control to provision the air conditioning resources and workload distribution. A variable cooling system comprising variable capacity computer room air conditioning units, variable air moving devices, adjustable vents, etc. are used to dynamically allocate air conditioning resources where and when needed. A distributed metrology layer is used to sense environment variables like temperature and pressure, and power. The data center energy manager redistributes the compute workloads based on the most energy efficient availability of cooling resources and vice versa. The distributed control layer is no longer associated with any single localized temperature measurement but based on parameters calculated from an aggregation of sensors. The compute resources not in use are put on "standby" thereby providing added savings.
AB - The data center of tomorrow is characterized as one containing a dense aggregation of commodity computing, networking and storage hardware mounted in industry standard racks. In fact, the data center is a computer. The walls of the data center are akin to the walls of the chassis in today's computer system. The new slim rack mounted systems and blade servers enable reduction in the footprint of today's data center by 66%. While maximizing computing per unit area, this compaction leads to extremely high power density and high cost associated with removal of the dissipated heat. Today's approach of cooling the entire data center to a constant temperature sampled at a single location, irrespective of the distributed utilization, is too energy inefficient. We propose a smart cooling system that provides localized cooling when and where needed and works in conjunction with a compute workload allocator to distribute compute workloads in the most energy efficient state. This paper shows a vision and construction of this intelligent data center that uses a combination of modeling, metrology and control to provision the air conditioning resources and workload distribution. A variable cooling system comprising variable capacity computer room air conditioning units, variable air moving devices, adjustable vents, etc. are used to dynamically allocate air conditioning resources where and when needed. A distributed metrology layer is used to sense environment variables like temperature and pressure, and power. The data center energy manager redistributes the compute workloads based on the most energy efficient availability of cooling resources and vice versa. The distributed control layer is no longer associated with any single localized temperature measurement but based on parameters calculated from an aggregation of sensors. The compute resources not in use are put on "standby" thereby providing added savings.
KW - Computer room air conditioning
KW - Cooling
KW - Data center
KW - High power data center
KW - Power
KW - Smart cooling
UR - https://www.scopus.com/pages/publications/1242287075
U2 - 10.1115/ipack2003-35059
DO - 10.1115/ipack2003-35059
M3 - Conference contribution
AN - SCOPUS:1242287075
SN - 0791836916
SN - 9780791836910
T3 - Advances in Electronic Packaging
SP - 129
EP - 137
BT - Advances in Electronic Packaging 2003
PB - American Society of Mechanical Engineers
T2 - 2003 International Electronic Packaging Technical Conference and Exhibition
Y2 - 6 July 2003 through 11 July 2003
ER -