Smart chip, system and data center enabled by advanced flexible cooling resources
- Chandrakant D. Patel*
- , Cullen E. Bash
- , Ratnesh Sharma
- , Abdlmonem Beitelmal
- , Christopher G. Malone
*Corresponding author for this work
- Hewlett-Packard
Research output: Contribution to journal › Conference article › peer-review
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