Numerical analysis of the reliability of photovoltaic modules based on the fatigue life of the copper interconnects

Keyphrases

• 3D Finite Element 50%
• Thermo-mechanical Stress 50%
• Thermal Expansion Mismatch 50%
• Fatigue Criterion 50%
• Lamination Process 50%
• Maximum Stress 50%
• Thermal Load 50%
• Thermal Stress-strain 50%
• 2D Finite Element 50%

Engineering

• Coefficient of Thermal Expansion 100%
• Lamination Process 50%
• Local Model 50%
• Thermal Load 50%
• Maximum Stress 50%

Material Science

• Thermal Stress 50%
• Thermal Load 50%