TY - JOUR
T1 - Microchannel heat sinks with nanofluids for cooling electronic components
T2 - Performance enhancement, challenges, and limitations
AU - Maghrabie, Hussein M.
AU - Olabi, A. G.
AU - Sayed, Enas Taha
AU - Wilberforce, Tabbi
AU - Elsaid, Khaled
AU - Doranehgard, Mohammad Hossein
AU - Abdelkareem, Mohammad Ali
N1 - Publisher Copyright:
© 2022 Elsevier Ltd
PY - 2023/1/1
Y1 - 2023/1/1
N2 - Nowadays, the cooling of electronic components that are widely spread globally is considered a critical issue. Designers and engineers alike confront major obstacles in electronic devices, to find a reliable method to overcome the issues of dissipating high heat flux and ensuring an acceptable limit of operating temperature. The current work attempts to study fluid flow, heat transfer, and thermal performance to avoid hot spots in electronic devices. To intensify the heat rate of electronic components in sophisticated applications with minimum size, the utilization of specified working nanofluids (NFs) rather than traditional ones was promoted. The thermal behavior of a microchannel heat sink (MCHS) utilizing different nanofluids depends essentially on the thermophysical properties of nanoparticles (NPs). In the current study, the aspects related to the cooling of electronics using nanofluids in microchannels (MCs) are deeply discussed. Regarding the distinctive characteristics of the nanoparticles, researchers have noted noteworthy progress in the cooling of electronics, including the use of hybrid nanoparticles, electronics with rough surfaces, utilizing phase change material (PCM), employment of modified channels, and other effects. The thermophysical properties, behaviors, performance, challenges, applications, limitations, and future prospects of nanofluids in electronic components are also presented.
AB - Nowadays, the cooling of electronic components that are widely spread globally is considered a critical issue. Designers and engineers alike confront major obstacles in electronic devices, to find a reliable method to overcome the issues of dissipating high heat flux and ensuring an acceptable limit of operating temperature. The current work attempts to study fluid flow, heat transfer, and thermal performance to avoid hot spots in electronic devices. To intensify the heat rate of electronic components in sophisticated applications with minimum size, the utilization of specified working nanofluids (NFs) rather than traditional ones was promoted. The thermal behavior of a microchannel heat sink (MCHS) utilizing different nanofluids depends essentially on the thermophysical properties of nanoparticles (NPs). In the current study, the aspects related to the cooling of electronics using nanofluids in microchannels (MCs) are deeply discussed. Regarding the distinctive characteristics of the nanoparticles, researchers have noted noteworthy progress in the cooling of electronics, including the use of hybrid nanoparticles, electronics with rough surfaces, utilizing phase change material (PCM), employment of modified channels, and other effects. The thermophysical properties, behaviors, performance, challenges, applications, limitations, and future prospects of nanofluids in electronic components are also presented.
KW - Electronics
KW - Microchannel heat sinks
KW - Nanofluids
KW - Performance enhancement and limitations
KW - Pressure drop
UR - https://www.scopus.com/pages/publications/85144630213
U2 - 10.1016/j.tsep.2022.101608
DO - 10.1016/j.tsep.2022.101608
M3 - Review article
AN - SCOPUS:85144630213
SN - 2451-9049
VL - 37
JO - Thermal Science and Engineering Progress
JF - Thermal Science and Engineering Progress
M1 - 101608
ER -