TY - GEN
T1 - Fabrication technology of piezoresistive conductive PDMS for micro fingerprint sensors
AU - Lu, Miao
AU - Bermak, Amine
AU - Lee, Yi Kuen
PY - 2007
Y1 - 2007
N2 - This paper reports the characterization of piezoresistivity of Conductive Polydimethylsiloxane (CPDMS) and the corresponding fabricating process for a parylene-coated, CPDMS Micro Fingerprint Sensor (MFS) with mushroom-shaped electrodes. Gauge factor of about 7.4 was demonstrated, and the piezoresistive sensitivity was about 3×10-6 Pa-1 in the tensile test setup. The packaged MFS sensors were characterized by a pneumatic test and a nanoindentation test. We demonstrate that the fabricated device can detect pressure and force levels bellow 10 kPa and 50 μN, respectively. The use of the material and process presented in this paper offers the opportunity to realize a robust micro fingerprint sensor with low cost, low temperature process on different substrates.
AB - This paper reports the characterization of piezoresistivity of Conductive Polydimethylsiloxane (CPDMS) and the corresponding fabricating process for a parylene-coated, CPDMS Micro Fingerprint Sensor (MFS) with mushroom-shaped electrodes. Gauge factor of about 7.4 was demonstrated, and the piezoresistive sensitivity was about 3×10-6 Pa-1 in the tensile test setup. The packaged MFS sensors were characterized by a pneumatic test and a nanoindentation test. We demonstrate that the fabricated device can detect pressure and force levels bellow 10 kPa and 50 μN, respectively. The use of the material and process presented in this paper offers the opportunity to realize a robust micro fingerprint sensor with low cost, low temperature process on different substrates.
UR - https://www.scopus.com/pages/publications/52249123455
M3 - Conference contribution
AN - SCOPUS:52249123455
SN - 1424409519
SN - 9781424409518
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 251
EP - 254
BT - Proceedings - CIS Workshops 2007, 2007 International Conference on Computational Intelligence and Security Workshops, CISW 2007
T2 - 20th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2007
Y2 - 21 January 2007 through 25 January 2007
ER -