TY - GEN
T1 - An Inkjet-printed Strain Sensor with a Carbon-Silver-Polyimide Topology
AU - Yi, Ying
AU - Ali, Shawkat
AU - Wang, Bo
N1 - Publisher Copyright:
© 2019 IEEE.
PY - 2019/7
Y1 - 2019/7
N2 - This paper presents a fully printed strain sensor consisting of carbon ink [1] coating layer and interdigitated shape silver (Ag) ink electrodes solidified on a polyimide (PI) substrate. The carbon ink provides an output of an increase in resistance when the substrate is bent because the occurred cracks break electrical conducting pathways in the solidified ink layer [2]. Improving on the works with only single carbon ink layer [2], an addition of the Ag ink electrodes brings extra resistance increase due to the occurrence of metallic cracks. A 1.5 × 1.5 cm size strain sensor is fabricated to verify the performance of our proposed topology. The results show that the maximum resistance change ratio of the sensor with interdigitated electrodes reaches 7.9%, which is ∼12.5% higher than that using carbon ink alone. Because of the low-cost fabrication and the improved sensing capability, our proposed strain sensor can be further optimized for wearable electronics and structure health monitoring applications.
AB - This paper presents a fully printed strain sensor consisting of carbon ink [1] coating layer and interdigitated shape silver (Ag) ink electrodes solidified on a polyimide (PI) substrate. The carbon ink provides an output of an increase in resistance when the substrate is bent because the occurred cracks break electrical conducting pathways in the solidified ink layer [2]. Improving on the works with only single carbon ink layer [2], an addition of the Ag ink electrodes brings extra resistance increase due to the occurrence of metallic cracks. A 1.5 × 1.5 cm size strain sensor is fabricated to verify the performance of our proposed topology. The results show that the maximum resistance change ratio of the sensor with interdigitated electrodes reaches 7.9%, which is ∼12.5% higher than that using carbon ink alone. Because of the low-cost fabrication and the improved sensing capability, our proposed strain sensor can be further optimized for wearable electronics and structure health monitoring applications.
UR - https://www.scopus.com/pages/publications/85071358031
U2 - 10.1109/FLEPS.2019.8792238
DO - 10.1109/FLEPS.2019.8792238
M3 - Conference contribution
AN - SCOPUS:85071358031
T3 - FLEPS 2019 - IEEE International Conference on Flexible and Printable Sensors and Systems, Proceedings
BT - FLEPS 2019 - IEEE International Conference on Flexible and Printable Sensors and Systems, Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 1st IEEE International Conference on Flexible and Printable Sensors and Systems, FLEPS 2019
Y2 - 7 July 2019 through 10 July 2019
ER -