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A Sensitivity-Enhanced MEMS-ASIC Integrated Thermal Flow Sensor Based on an Improved Constant Temperature Difference Control Scheme

  • Ziqi Liu
  • , Kai Qiao
  • , Xinyuan Zhang
  • , Xinbo Jiang
  • , Daishan Yue
  • , Zong Liu
  • , Huikai Xie
  • , Bo Wang*
  • , Xiaoyi Wang*
  • *Corresponding author for this work
  • Beijing Institute of Technology
  • The University of Hong Kong
  • Hong Kong University of Science and Technology

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

This paper presents an improved constant temperature difference (iCTD) control scheme for MEMS thermal flow sensors, in which the downstream detector is employed as the on-chip reference temperature element. By maintaining a constant temperature difference (ΔTh_d) between the microheater and the downstream detector through a modified feedback bridge, the proposed scheme leverages higher microheater temperatures to enhance response. The functionality and stability of this architecture were rigorously verified through a system-level MEMS-ASIC co-simulation. Experimental results demonstrate that under an initial overheat temperature (ΔTh_a) of 45 K at zero flow, the iCTD scheme achieves an average improvement of 26.7% in normalized sensitivity across the entire measurement range compared to the conventional CTD approach.

Original languageEnglish
Title of host publication2026 IEEE 21st International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2026
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages600-603
Number of pages4
ISBN (Electronic)9798319519351
DOIs
Publication statusPublished - 21 Apr 2026
Event21st IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2026 - Chengdu, China
Duration: 17 Apr 202621 Apr 2026

Publication series

Name2026 IEEE 21st International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2026

Conference

Conference21st IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2026
Country/TerritoryChina
CityChengdu
Period17/04/2621/04/26

Keywords

  • Improved constant temperature difference
  • MEMS
  • System-level model
  • Thermal flow sensor

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