A novel method for the fabrication of a high-density carbon nanotube microelectrode array

Adam Khalifa; Zhaoli Gao; Amine Bermak; Yi Wang; Leanne Lai Hang Chan

doi:10.1016/j.sbsr.2015.04.001

A novel method for the fabrication of a high-density carbon nanotube microelectrode array

Adam Khalifa^*, Zhaoli Gao, Amine Bermak, Yi Wang, Leanne Lai Hang Chan

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

11 Citations (Scopus)

Abstract

We present a novel method for fabricating a high-density carbon nanotube microelectrode array (MEA) chip. Vertically aligned carbon nanotubes (VACNTs) were synthesized by microwave plasma-enhanced chemical vapor deposition and thermal chemical vapor deposition. The device was characterized using electrochemical experiments such as cyclic voltammetry, impedance spectroscopy and potential transient measurements. Through-silicon vias (TSVs) were fabricated and partially filled with polycrystalline silicon to allow electrical connection from the high-density electrodes to a stimulator microchip. In response to the demand for higher resolution implants, we have developed a unique process to obtain a high-density electrode array by making the microelectrodes smaller in size and designing new ways of routing the electrodes to current sources.

Original language	English
Pages (from-to)	1-7
Number of pages	7
Journal	Sensing and Bio-Sensing Research
Volume	5
DOIs	https://doi.org/10.1016/j.sbsr.2015.04.001
Publication status	Published - 1 Sept 2015
Externally published	Yes

Keywords

Carbon nanotubes
Microelectrode array
Microfabrication
Neural implant
Through-silicon via interconnects

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10.1016/j.sbsr.2015.04.001

Cite this

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title = "A novel method for the fabrication of a high-density carbon nanotube microelectrode array",

abstract = "We present a novel method for fabricating a high-density carbon nanotube microelectrode array (MEA) chip. Vertically aligned carbon nanotubes (VACNTs) were synthesized by microwave plasma-enhanced chemical vapor deposition and thermal chemical vapor deposition. The device was characterized using electrochemical experiments such as cyclic voltammetry, impedance spectroscopy and potential transient measurements. Through-silicon vias (TSVs) were fabricated and partially filled with polycrystalline silicon to allow electrical connection from the high-density electrodes to a stimulator microchip. In response to the demand for higher resolution implants, we have developed a unique process to obtain a high-density electrode array by making the microelectrodes smaller in size and designing new ways of routing the electrodes to current sources.",

keywords = "Carbon nanotubes, Microelectrode array, Microfabrication, Neural implant, Through-silicon via interconnects",

author = "Adam Khalifa and Zhaoli Gao and Amine Bermak and Yi Wang and \{Hang Chan\}, \{Leanne Lai\}",

note = "Publisher Copyright: {\textcopyright} 2015 The Authors.",

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doi = "10.1016/j.sbsr.2015.04.001",

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T1 - A novel method for the fabrication of a high-density carbon nanotube microelectrode array

AU - Khalifa, Adam

AU - Gao, Zhaoli

AU - Bermak, Amine

AU - Wang, Yi

AU - Hang Chan, Leanne Lai

PY - 2015/9/1

Y1 - 2015/9/1

N2 - We present a novel method for fabricating a high-density carbon nanotube microelectrode array (MEA) chip. Vertically aligned carbon nanotubes (VACNTs) were synthesized by microwave plasma-enhanced chemical vapor deposition and thermal chemical vapor deposition. The device was characterized using electrochemical experiments such as cyclic voltammetry, impedance spectroscopy and potential transient measurements. Through-silicon vias (TSVs) were fabricated and partially filled with polycrystalline silicon to allow electrical connection from the high-density electrodes to a stimulator microchip. In response to the demand for higher resolution implants, we have developed a unique process to obtain a high-density electrode array by making the microelectrodes smaller in size and designing new ways of routing the electrodes to current sources.

AB - We present a novel method for fabricating a high-density carbon nanotube microelectrode array (MEA) chip. Vertically aligned carbon nanotubes (VACNTs) were synthesized by microwave plasma-enhanced chemical vapor deposition and thermal chemical vapor deposition. The device was characterized using electrochemical experiments such as cyclic voltammetry, impedance spectroscopy and potential transient measurements. Through-silicon vias (TSVs) were fabricated and partially filled with polycrystalline silicon to allow electrical connection from the high-density electrodes to a stimulator microchip. In response to the demand for higher resolution implants, we have developed a unique process to obtain a high-density electrode array by making the microelectrodes smaller in size and designing new ways of routing the electrodes to current sources.

KW - Carbon nanotubes

KW - Microelectrode array

KW - Microfabrication

KW - Neural implant

KW - Through-silicon via interconnects

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U2 - 10.1016/j.sbsr.2015.04.001

DO - 10.1016/j.sbsr.2015.04.001

M3 - Article

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EP - 7

JO - Sensing and Bio-Sensing Research

JF - Sensing and Bio-Sensing Research

ER -

A novel method for the fabrication of a high-density carbon nanotube microelectrode array

Abstract

Keywords

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