TY - GEN
T1 - A highly scalable 3D chip for binary neural network classification applications
AU - Bermak, Amine
PY - 2003
Y1 - 2003
N2 - This paper describes a 3D VLSI Chip for binary neural network classification applications. The 3D circuit includes three layers of MCM integrating 4 chips each making it a total of 12 chips integrated in a volume of (2 × 2 × 0.7)cm3. The architecture is scalable, and real-time binary neural network classifier systems could be built with one, two or all twelve chip solutions. Each basic chip includes an on-chip control unit for programming options of the neural network topology and precision. The system is modular and presents easy expansibility without requiring extra devices. Experimental test results showed that a full recall operation is obtained in less than 1.2μs for any topology with 4-bit or 8-bit precision while it is obtained in less than 2.2μs for any 16-bit precision. As a consequence the 3D chip is a very powerful reconfigurable and a multiprecision neural chip exhibiting a significant speed of 1.25 GCPS.
AB - This paper describes a 3D VLSI Chip for binary neural network classification applications. The 3D circuit includes three layers of MCM integrating 4 chips each making it a total of 12 chips integrated in a volume of (2 × 2 × 0.7)cm3. The architecture is scalable, and real-time binary neural network classifier systems could be built with one, two or all twelve chip solutions. Each basic chip includes an on-chip control unit for programming options of the neural network topology and precision. The system is modular and presents easy expansibility without requiring extra devices. Experimental test results showed that a full recall operation is obtained in less than 1.2μs for any topology with 4-bit or 8-bit precision while it is obtained in less than 2.2μs for any 16-bit precision. As a consequence the 3D chip is a very powerful reconfigurable and a multiprecision neural chip exhibiting a significant speed of 1.25 GCPS.
UR - https://www.scopus.com/pages/publications/0037743771
M3 - Conference contribution
AN - SCOPUS:0037743771
SN - 0780377613
T3 - Proceedings - IEEE International Symposium on Circuits and Systems
SP - V685-V688
BT - Proceedings of the 2003 IEEE International Symposium on Circuits and Systems, ISCAS 2003
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2003 IEEE International Symposium on Circuits and Systems, ISCAS 2003
Y2 - 25 May 2003 through 28 May 2003
ER -